0.3 0.35 0.4 0.5mm BGA Reballing Stencil Square Hole Direct Heating for Phone CPU IC Chips BGA Template Planting Tin Steel Mesh
0.3 0.35 0.4 0.5mm BGA Reballing Stencil Square Hole Direct Heating for Phone CPU IC Chips BGA Template Planting Tin Steel Mesh
0.3 0.35 0.4 0.5mm BGA Reballing Stencil Square Hole Direct Heating for Phone CPU IC Chips BGA Template Planting Tin Steel Mesh
0.3 0.35 0.4 0.5mm BGA Reballing Stencil Square Hole Direct Heating for Phone CPU IC Chips BGA Template Planting Tin Steel Mesh
0.3 0.35 0.4 0.5mm BGA Reballing Stencil Square Hole Direct Heating for Phone CPU IC Chips BGA Template Planting Tin Steel Mesh
0.3 0.35 0.4 0.5mm BGA Reballing Stencil Square Hole Direct Heating for Phone CPU IC Chips BGA Template Planting Tin Steel Mesh

0.3 0.35 0.4 0.5mm BGA Reballing Stencil Square Hole Direct Heating for Phone CPU IC Chips BGA Template Planting Tin Steel Mesh

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Giá rẻ và giảm giá 0.3 0.35 0.4 0.5mm BGA Reballing Stencil Square Hole Direct Heating for Phone CPU IC Chips BGA Template Planting Tin Steel Mesh Bán buôn. Mua trực tiếp từ người bán DIYPHONE Store. Tận hưởng ✓ Vận chuyển miễn phí trên toàn thế giới! ✓ Bảo vệ người mua trong 90 ngày. ✓ Dễ dàng trở lại. ✓ Đảm bảo hoàn lại tiền.

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